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To activate the pro feature, install the Autodesk Network Program Office and have it activate. For more information please visit our web page A semiconductor wafer is a thin slice of semiconductor material, such as silicon or gallium arsenide, on which integrated circuits are fabricated. A semiconductor wafer can have a plurality of integrated circuits or “dots” thereon. Each semiconductor wafer can be made from a larger slice of semiconductor material, such as a silicon ingot, on which multiple semiconductor wafers are fabricated. Integrated circuits are fabricated by patterning regions of the semiconductor wafer. Semiconductor fabrication typically requires patterning of the surface of a wafer. Patterning can be accomplished with a variety of known techniques including photolithography, masking, and etching. The formation of a pattern in a layer of photoresist can include a step of charging or activating the photoresist and a step of selectively exposing portions of the photoresist to electromagnetic radiation. After the pattern is formed, the photoresist is developed to remove either the exposed or the unexposed portions of the photoresist. The photoresist is typically an organic material, and, therefore, it must be removed from the wafer after the patterning. Wafers are typically cleaned with a plurality of chemical and/or physical solutions to remove the photoresist. One conventional process for removing photoresist is a wet chemical strip process, in which the wafer is immersed in a liquid chemical solution to dissolve or disperse photoresist. The photoresist in the liquid chemical solution can be removed by spinning, by means of a scrubber, or by agitation to physically remove photoresist. The liquid chemical solution is generally known as a stripping solution. Many stripping solutions are acidic, to avoid corroding the wafer surface. Acidic stripping solutions can dissolve the photoresist without attacking the underlying wafer substrate, and without causing defects in the integrated circuits. Acid stripping solutions are typically aqueous solutions, although non-aqueous solutions are known. One aqueous acid stripping solution is a standard ammonium persulfate solution. An ammonium persulfate solution requires frequent cleaning and preparation for optimal stripping. Ammonium persulfate solutions are inherently reactive, and, therefore, they are not suitable for automated application. Additionally, ammonium pers
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